| 摘要 |
<p>A thick film compsn. comprises: (A) 50-90 wt.% of finely divided particles of metallic conductive phase; (B) 1-18 wt.% of an inorganic binder phase with at least one glass, metal oxide, metal oxide precursor, pyrochlore-related cpd., or pyrochlore-related precursor cpd., where the metal is copper, cobalt, lead, bismuth, zinc, nickel, manganese or iron; (C) 0.01-3.0 wt.% adhesion promoter of formula selected from [Ma1+]x[Mb2+]1-xAl2-xSi2-xO8, [Mc3+]x[Mb2+]1-xAl2+xSi2-xO8 and [Md]2[Me][Mf]2Op (where, Ma=K or Na; Mb = Ca; Mc = Bi, Fe, Mn, Cr, V, Sc, In, Y, Gd, Eu, Sm, Nd, Pr, Ce, La or Sb; Md = Ca or Na; Me = Mg or Al; Mf = Si or Al; and x = 0-1); and (D) an organic medium as the balance. All of (A), (B) and (C) are dispersed in (D).</p> |
