发明名称 |
Heat-sensitive stencil sheet |
摘要 |
Disclosed is a heat-sensitive stencil sheet having its perforating and separating properties in the case of doing stencil-making by thermal heads and not allowing a releasing layer thereof to transfer to the other stencil sheet even in the case of stacking the heat-sensitive sheet to each other. The heat-sensitive stencil sheet comprises a porous substrate, a thermoplastic resin film laminated thereon with an adhesive, and a releasing layer provided on the thermoplastic resin film, wherein the releasing layer mainly consists of silicone phosphate.
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申请公布号 |
US5559074(A) |
申请公布日期 |
1996.09.24 |
申请号 |
US19950420036 |
申请日期 |
1995.04.11 |
申请人 |
RISO KAGAKU CORPORATION |
发明人 |
WATANABE, HIDEO;OKUDA, SADANAO |
分类号 |
B41N1/24;(IPC1-7):G01B3/14 |
主分类号 |
B41N1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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