| 摘要 |
A package-type solid electrolytic capacitor is provided which comprises: a capacitor chip having a first end and a second end opposite to the first end, the chip being formed with a cathode terminal coating at least covering the second end; an anode wire partially projecting from the first end of the chip; a plate-like metal anode lead having an inner end electrically connected to the anode wire; a plate-like metal cathode lead having an inner end electrically connected to the cathode terminal coating of the chip; and a resin package enclosing the capacitor chip, the anode wire and the inner ends of the anode and cathode leads. The cathode lead has a wider portion projecting out of the resin package, and the inner end of the cathode lead is narrower and held in abutment with and electrically connected to the cathode terminal coating at the second end of the chip.
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