| 摘要 |
A semiconductor device with a semiconductor pellet or pellets mounted on a lead frame and a plastic-molded package, which enables a larger scale integration of circuits than the conventional ones to realize down-sizing. A die pad of the leadframe has a first insulator film formed thereon, a patterned interconnection film formed on the first insulator film, and a second insulator film formed on the first insulator film to cover the interconnection film. Bonding pads of the semiconductor pellet are directly bonded through first windows of the second insulator film to the interconnection film, respectively so that the pellet is electrically connected to the interconnection film. Inner leads of the leadframe are electrically connected through second windows of the second insulator film to the interconnection film, respectively. thus, the bonding pads of the semiconductor pellet are electrically connected through the interconnection film to the inner leads, respectively. The bonding pads are preferably joined to the interconnection film using solder balls.
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