| 摘要 |
PROBLEM TO BE SOLVED: To reuse a preconditioning plate for preparing a polishing pad used for flattening a semiconductor substrate and to reduce the cycle time for the preconditioning. SOLUTION: A preconditioning plate 10 prepares and adjusts the surface of a polishing pad 24 for preparing a pad surface for subsequent metal polishing of a semiconductor wafer 27. The preconditioning plate is provided with at least three intersecting radial ridges 14 on its surface and formed of a rigid plastic material. The preconditioning plate is rotated relative to the surface of the polishing pad prior to practical polishing to provide the uniform and stable polishing face. |
