Fine pitch capillary/wedge bonding tool

摘要

A novel high-speed capillary/wedge bonding tool is provided for use on an automatic fine wire bonder which has either a rotating bonding head or a workstation which rotates relative to the bonding head. The novel working tip of the novel bonding tool is provided with two closely spaced parallel sides having substantially zero degree cone angle when viewed from the side. The bonding tool is further provided with a substantially rectangular shaped wedge foot which extends between a segment of the chamfer diameter and a segment of the tip diameter when viewed from the front. In the preferred embodiment, the novel chamfer recess in the novel capillary/wedge bonding tool is elongated so that balls bonded at first bond are more narrow in width than in length and occupy approximately the same area as prior art high speed gold ball bonds. The novel rectangular wedge shape foot produces second mashed wedge wire bonds which are as robust as, and/or stronger than prior art mashed wedge wire bonds.