POLYMERIC SOLDER COMPOSITION

摘要

A sealant compsn. prepd. by heating to >=190 degrees F a mixt. comprising (A) 30-70 pts.wt.of an olefinically unsatd.liq. polymer of a 4-8C diolefinic hydrocarbon, a major part having two terminal allylic bromide gps., (B) 30-70 pts. wt. of an epoxy cpd. having equiv. et. 170-210, and (C) 20-100 pts.wt. (per 100 pts.wt. (A) + (B) of a polyfunctional amine terminated polyamide having amine equiv. wt. of 130-160. The solder compsn. has excellent adhesive strength with metal, as well as the needed ductibility to correlate to the expansion and contraction of the metal substrate; suitable for automotive applications.