COMPOUND SEMICONDUCTOR DEVICE

摘要

PURPOSE: To obtain the subject device, responsive to the shortening of an assembly step and saving of energy and having high reliability by bonding and fixing a compound semiconductor chip and a lead frame with a specific electroconductive paste. CONSTITUTION: This device is obtained by bonding and fixing a semiconductor chip and a lead frame with an electroconductive paste consisting essentially of (A) a modified resin comprising (i) an epoxy resin and (ii) a sulfonium salt of formula I (X is CH3 , H, a halogen or NO2 ; M is Sb, As or P) or formula II (R<1> and R<2> are each an alkyl, a halogen or H; R<3> is an ether or an ester; A<-> is SbF6 <-> , AsF6 <-> , PF6 <-> or CH3 SO4 <-> ), (B) an electroconductive filter (e.g. silver powder) and (C) a solvent, a monomer or a mixture thereof (e.g. Methyl Cellosolve). Furthermore, the sulfonium salt in the component (ii) is preferably blended in an amount of 0.5-20 pts.wt. based on 100 pts.wt. component (i).