发明名称 HOLLOW MOLDING METHOD AND RESIN MOLD
摘要 PURPOSE: To provide a resin mold not generating the adhesion of an excessive resin to a resin molded product and surface inferiority such as weld or a sink in a hollow molding method. CONSTITUTION: The cavity 1 formed by upper and lower molds A, B, fluid pressure introducing ports 6, 6 introducing a hollow part forming fluid under pressure to form a hollow part in the molten resin 2 charged in the cavity 1 to fill the cavity with a resin molded product by the pressure of the fluid, the movable cores 70, 70 provided to a part of the cavity 1 and moving while increasing the cavity by the quantity corresponding to the vol. receiving the molten resin 2 to finally deform the inner surface of the cavity 1 to the shape of the resin molded product and a control part 10 controlling the moving speed of the movable cores 70, 70 to a predetermined range are provided.
申请公布号 JPH08244062(A) 申请公布日期 1996.09.24
申请号 JP19950052144 申请日期 1995.03.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUSE HIROKI;MORIMOTO TAKASHI;SOYAMA TAKAHIKO
分类号 B29C45/00;B29C45/17;B29C45/26;B29C45/56;B29C45/57;B29C45/80;B29L22/00;(IPC1-7):B29C45/00 主分类号 B29C45/00
代理机构 代理人
主权项
地址