Stencil perforating method, stencil perforating system, and stencil printing machine

摘要

A heat sensitive stencil is brought into contact with a thermal head having a plurality of heating resistors arranged in a row, is moved in a sub-scanning direction orthogonal to a direction in which the heating resistors are arranged, and is perforated in the dot matrix shape with selectively heated heating resistors. The heat sensitive stencil is made substantially only of a thermoplastic resin film. A width of a non-perforated portion of the heat sensitive stencil between two adjacent perforations is 20% or more of a pitch between two adjacent heating resistors in the main scanning direction.