发明名称 HEAT-RESISTANT EPOXY RESIN COMPOSITION
摘要 <p>A thermosetting epoxy composition comprising one or more trifunctional epoxy compounds having a molecular structure wherein the three epoxy groups are disposed symmetrically, and one or more N-substituted melamines of general formula (I), (wherein X is (a) and R1 to R6 are each independently H, C¿1?-C18 alkyl, C1-C18 hydroxyalkyl, C4-C8 cycloalkyl, C5-C9 cycloalkylmethyl or C5-C9 methylcycloalkyl, with the proviso that three to five members of R?1 to R6¿ must be hydrogen, or alternatively R?5 and R6¿ may be united to form -(CH¿2?)4-7- or -CH2CH2-O-CH2-CH2-), characterized in that the amount of the active hydrogen atom present in the primary and/or secondary amino groups of the N-substituted melamine(s) is 0.1 to 0.7 equivalent per equivalent of the epoxy group of the trifunctional epoxy compound(s); and a heat-resistant epoxy resin composition obtained by thermosetting the above epoxy composition. The above epoxy composition is easy to handle and the above epoxy resin composition exhibits extremely high heat and chemical resistances.</p>
申请公布号 WO1996028490(P1) 申请公布日期 1996.09.19
申请号 JP1996000621 申请日期 1996.03.13
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