发明名称 PROCESS FOR PREPARING RESIN MOLDING HAVING FINE RECESSES ON THE SURFACE THEREOF
摘要 A process for preparing a resin molding having fine recesses formed on the surface thereof to roughen the same and impart thereto an excellent adhesiveness to metal and other material. The process comprises applying a powder soluble in a chemical solution on the surface of a resin molding to deposit thereon or embed therein the powder and removing the same by dissolving in the chemical solution.
申请公布号 WO9628502(A1) 申请公布日期 1996.09.19
申请号 WO1996JP00659 申请日期 1996.03.15
申请人 W.R. GRACE & CO. - CONN.;KINASHI, KEIICHI;CHIBA, REIKO;HAGIWARA, YOSHICHI 发明人 KINASHI, KEIICHI;CHIBA, REIKO;HAGIWARA, YOSHICHI
分类号 C08J7/00;C08J7/02;C08J9/26;C09J5/02;H05K3/38;H05K3/46;(IPC1-7):C08J7/00;H05K3/00 主分类号 C08J7/00
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