发明名称 Mfg. printed circuit assembly for construction of sub-assemblies in e.g. microwave electronic equipment
摘要 The circuit mfr. involves the generation of a number of circuit zones (1a,1b,1n) on a single main printed circuit board (1) where each zone contains a conductor pattern (1c). One or more sets of connecting wires (3) are attached to connection pads (1w) on the circuit board, by which the multiple circuit zones are mechanically interlinked, and after this step the main circuit board is divided into individual circuit building blocks.
申请公布号 DE19541334(A1) 申请公布日期 1996.09.19
申请号 DE1995141334 申请日期 1995.11.06
申请人 FUJITSU LTD., KAWASAKI, KANAGAWA, JP 发明人 MUGIYA, HIROSHI, KAWASAKI, KANAGAWA, JP
分类号 H05K9/00;H01L21/48;H01L21/66;H01L23/36;H01L23/48;H01L23/50;H05K1/02;H05K1/05;H05K3/00;H05K3/34;H05K5/00;(IPC1-7):H05K3/32;H01L23/34;G01R31/28;H01L21/60 主分类号 H05K9/00
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