High packing density circuit board

摘要

A circuit board has, on at least one side, devices applied by thin film technology employing chemical metal deposition. Pref. the devices have a layer thickness of less than 3 (pref. less than 1) micron and the board has a multilayer structure of two or more circuit board layers (2,3,4). Also claimed is a process for prodn. of the above circuit board by: (a) placing a substrate (pref. a Cu-clad substrate board) in an activating soln. to activate the regions where devices are to be produced; and (b) placing the substrate in a chemical metal plating bath to deposit a metal (pref. Pd) layer for forming the devices.