发明名称 RESIN COMPOSITION
摘要 PURPOSE:A resin composition suitable for continuous molding of packaging materials having improved stretchability, gas barrier properties, hot-water, oil, and impact resistance, consisting of a saponified ethylene-vinyl acetate copolymer and a specific copolyamide. CONSTITUTION:A resin composition consisting of (A) 60-95 wt. % of a saponified ethylene-vinyl acetate copolymer (preferably, an ethylene content of 10-45 wt.% and a saponification degree >=90 %) and (B) 5-40 wt. % of a copolyamide (e.g., nylon 6/6I, etc.) consisting of a) 50-95 wt. % of capramide unit and (b) 5-50 wt. % of an aromatic and/or an alicyclic unit. USE:packaging materials, e.g., films, sheets, tubes, plastic vessels, etc.
申请公布号 JPS5478750(A) 申请公布日期 1979.06.23
申请号 JP19770146464 申请日期 1977.12.06
申请人 TORAY INDUSTRIES;KURARAY CO 发明人 CHIBA KAZUMASA;MURAKI TOSHIO;HIROSE SHIYOUICHI
分类号 C08L23/00;C08L29/00;C08L29/04;C08L31/04;C08L77/00;C08L77/04;C08L101/00 主分类号 C08L23/00
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