| 摘要 |
PURPOSE:To releave external stress by resin, eliminate deposition stress by plating, and reduce stress by using conductive paste as core on an aluminum electrode part, and forming solder on the conductive paste. CONSTITUTION:On a wafer 1, an aluminum electrode 3 is formed; a protective film layer is formed on the whole surface of the wafer; a photo resist film is formed, exposed to light, and developed; a protective film layer above the aluminum electrode 3 is eliminated, and a protective film 2 is formed; a metal film layer 4a is formed on the whole surface of the wafer 1; a photo resist film is formed, exposed to light, and developed; the metal film layer 4a except the part above the aluminum electrode 3 is etched and eliminated; then a metal film 4 is formed; a dry film 7 is formed; by using a photo mask, exposure to light and development are performed; a resin bump 5 composed of conductive paste formed by dispersing conductive particle in resin is buried and hardened by heat or light; after the dry film 7 is eliminated, the resin bump 5 is dipped in a flow solder tank, thereby forming a solder bump 6. |
