| 摘要 |
A package for devices which operate at microwave frequencies, comprising a base (1) of metal or metallised non-conductor to act as a support member of the package and also as a thermal and electrical ground for a device when mounted within the package, an electrically insulating layer (2) on the base (1), an electrically non-conductive lid (4) having a peripheral region which is sealingly coupled to the electrically insulating layer (2) whereby the lid (4) defines, at least in part, an internal cavity (6) of the package which in use receives said device, and at least one metallic track (5) which runs from an internal connection zone (14) within the internal cavity (6), where it can be connected to said device, to an external connection zone (15) of the package where it can be connected to external circuitry. The track (5) is configured such as to maintain, at operating frequencies, a substantially constant impedance along its length when the lid (4) is in place. <IMAGE> |
