| 摘要 |
The method involves baking a stack of raw ceramic films (11,13). Structures (1,2,3) are pressed into one ceramic film (11). The structures (1,2,3) form a capacitor. The structures (1,2,3) are first generated on a carrier (10) and are then pressed into a ceramic film (11). After pressing, the carrier (10) is separated from the structures (1,2,3). The ceramic film (11) with the pressed in structures (1,2,3) is baked in the stack with other ceramic films (13). A first (1) and second (2) electrode may be provided for the capacitor. The electrodes (1,2) are applied to the carrier (10) by screen printing of a thick layer paste. A dielectric (3) is preferably provided between the electrodes (1,2). The electrodes (1,2) may be formed as flat electrodes or may be formed as an interengaging finger structure. |
| 申请人 |
ROBERT BOSCH GMBH, 70469 STUTTGART, DE |
发明人 |
GRUENWALD, WERNER, DIPL.-PHYS. DR., 70839 GERLINGEN, DE;ROETHLINGSHOEFER, WALTER, DIPL.-ING., 72766 REUTLINGEN, DE;GOEBEL, ULRICH, DR., 72760 REUTLINGEN, DE;HAUG, RALF, DIPL.-PHYS. DR., 71229 LEONBERG, DE;MOSER, MANFRED, DIPL.-ING., 72768 REUTLINGEN, DE;LAETSCH, ANNETTE, DIPL.-PHYS., 71277 RUTESHEIM, DE |
