| 摘要 |
PURPOSE:To effectively prevent cracks in a packaging resin for sealing essential parts of a semiconductor device when they are heated in a packaging process, by injecting a part of the packaging resin in a through hole of an intermediate plate bonded to the rear of the semiconductor device via a through hole of a die pad. CONSTITUTION:A part of packaging resin 6 is injected even in a through hole 2a of an intermediate plate via a die pad through hole 3a, and such part of the resin having a nail-head-like shape is engaged with the top of a die pad 3 near the through hole 3a. Thereby, the die pad 3 and the intermediate plate 2 are mechanically fixed to and supported by each other by means of that part of the packaging resin 6. Even when they are heated in a packaging process, the lower surface of the die pad 3 is sticked firmly to the upper surface of the lower part of the packaging resin 6 by the part of the resin 6 injected in the through hole 2a of the intermediate plate and the through hole 3a of the die pad. Since they are effectively prevented from being peeled off in this manner, the semiconductor device is completely free from the problem that internal stress which would be caused by peel-off is concentrated to the ends of the die pad 3 to make cracks in the packaging resin 6. |
