| 摘要 |
A semiconductor device comprising a base member (26) carrying thereon a semiconductor chip (20) via an interconnection pattern (27a) provided on an upper major surface of the base member, the semiconductor chip (20) carrying solder bumps (22) on a lower major surface thereof facing the upper major surface of the base member (26), such that the solder bumps establish a contact with the interconnection pattern (27a). The semiconductor chip (20) further carries an electrode pad (23) on the lower major surface, the electrode pad (23) having a melting temperature exceeding a melting temperature of the solder bumps and having a thickness (h) smaller than a height (H) of the solder bumps (22). <IMAGE> |
