Improved novolac type epoxy resin and electronic parts encapsulating resin composition.

摘要

This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15 % of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: (wherein R1 is hydrogen, halogen, alkyl, or aryl; R2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.)