发明名称 MULTILAYER ELECTRONIC PART AND MANUFACTURE THEREOF
摘要 <p>PURPOSE: To obtain a multilayer electronic part which is high in flexual strength when it is mounted on a circuit board and possessed of outer electrodes where a plating film or paste is easily applied and which can be lessened in arrangement pitch. CONSTITUTION: Insulating sheets are stucked interposing circuit components between them for the formation of a rectangular parallelopipedic multilayer body 11, and outer electrodes 13 electrically connected to the inner circuit components are provided to the outer surface of the multilayer body 11 for the formation of a multilayer electronic part 10, wherein at least a recessed part 12 is provided to one principal face 111 of the body 11 for the formation of a second face 111b recessed from the primary surface 111, and at least an outer electrode 13 is provided to the second face 111b.</p>
申请公布号 JPH08241827(A) 申请公布日期 1996.09.17
申请号 JP19950044351 申请日期 1995.03.03
申请人 MURATA MFG CO LTD 发明人 KUBOTA KENJI
分类号 H01G4/12;H01F41/04;H05K1/03;H05K3/40;H05K3/46;(IPC1-7):H01G4/12 主分类号 H01G4/12
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