| 摘要 |
PURPOSE: To obtain a mounting structure by which a high-performance and high-density mounting operation can be performed by a method wherein a socket body and an interlayer heat dissipating body for a multilayered integrated circuit are built in integrally, an electric connecting operation and a heat dissipating operation are performed simultaneously and the integrated circuit is shielded electrostatically by the interlayer heat dissipating body together with an upper-part heat sink at the uppermost part. CONSTITUTION: In a socket body 10, cutout parts are formed toward the lower part from the upper edge in four corners of sidewall faces which do not comprise an upper lid and which are box-shaped. Interlayer heat dissipating bodies 20, 30 are composed of stacked parts 21, 31 inserted between an integrated circuit 2 and an integrated circuit 3, of connection parts which are fitted to the cutout parts in the socket body and of heat dissipating parts along the wall faces at the outside of the socket body. Contact terminals, as a group, which come into contact with terminals of the integrated circuits are installed on the inside of the sidewall of the socket body, and the contact terminals are passed inside the wall faces of the socket body so as to be connected electrically to the external terminals. Heat dissipating parts at the interlayer heat dissipating bodies surround the socket body 10, and they form a shielding body together with an upper-part heat sink. |
