| 摘要 |
<p>To reduce failure and breakage of connecting wires connecting specific zones on semiconductor chips to semiconductor frames, the connecting wires are made of an aluminum-copper alloy having, by weight, 3 to 5%, preferably 4% copper, the remainder aluminum (neglecting incidental impurities), the diameter of the wires being between about 0.01 to 0.06 mm, preferably about 0.02 to 0.05 mm, connected to the frame and the semiconductor, respectively, by ultrasonic bonding.</p> |
