发明名称 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD
摘要 PURPOSE: To obtain a highly precision pattern even if a resist ink whose viscosity is lower than that of a usual one is used by making a surface roughness of a conductor in a resist pattern formation region extremely thinner than a minimum interval of a circuit pattern when forming a resist pattern by an ink jet head on a conductor. CONSTITUTION: A board made of epoxy, polyester, polyimide, BT resin, heat resistant epoxy resin, OTFE or silicone resin to a glass cloth or a material integrally provided with a 1 to 50μm-thick metallic conductor such as copper, aluminum, gold, silver or platinum coated with a resin mentioned by using a metal such as aluminum, copper and iron as a core. The surface roughness of the conductor of the board is preferably 5/1000 or less, especially, 5/1000 or less and 5/10000 or more of a minimum interval of the circuit pattern. When the roughness of the conductor surface exceeds 5/1000 of a minimum interval of the resist pattern, the pattern precision lowers, disconnection and shortcircuiting are generated and the yield lowers.
申请公布号 JPH08242060(A) 申请公布日期 1996.09.17
申请号 JP19950045655 申请日期 1995.03.06
申请人 CANON INC 发明人 INAMOTO TADAKI
分类号 B41J2/01;B05D1/26;B05D3/02;B05D3/10;H05K3/06;(IPC1-7):H05K3/06 主分类号 B41J2/01
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