发明名称 DEVICE FOR SEALING SEMICONDUCTOR
摘要 PURPOSE: To provide the subject device having excellent stability in terms of qualities, coated with a composition having excellent melt fluidity, high curing rate and excellent workability obtained by blending a crystalline epoxy resin with fused silica powder and a curing agent. CONSTITUTION: This device is coated with a composition obtained by blending (A) a crystalline epoxy resin, preferably a 4,4'-bis(2",3"-epoxypropoxy)-3,3',5,5'- tetramethylbiphenyl of the formula (R is CH or CH3) with (B) fused silica powder (e.g. quartz glass powder) having 0.1-30μm particle diameter and (C) a curing agent (e.g. diaminodiphenylmethane) in the ratio of preferably 100-300 pts. of the component B based on 100 pts.wt. of the component A. The blending ratio of the composition, for example, is preferably 0.5-1.5 as the ratio of the number of functional groups of the component C to that of the epoxy groups of the component A.
申请公布号 JPH08239557(A) 申请公布日期 1996.09.17
申请号 JP19960028124 申请日期 1996.02.15
申请人 NITTO DENKO CORP 发明人 NAKATSUKA HIROSHI;MAZAKI SHIRO;KAWAMOTO NORIO;SAITO KIYOSHI
分类号 C08K3/36;C08G59/20;C08G59/24;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K3/36
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