<p>This disclosure relates to the fabrication of components on a single crystal substrate. A method is disclosed of overcoming the problems encountered in defining etched features on a silicon substrate. In particular, there is disclosed a method of producing a multichip module comprising a silicon substrate having surface features for the placement of components. An organic dielectric is applied to the substrate prior to the use of an etchant whereby interconnects can be defined. <IMAGE></p>
申请公布号
EP0732739(A1)
申请公布日期
1996.09.18
申请号
EP19960301377
申请日期
1996.02.29
申请人
NORTEL NETWORKS CORPORATION
发明人
AYLIFFE, PETER JOHN;HARRISON, PAUL MARK;GEEAR, MARTINE CHRISTOPHER;PARKER, JAMES WILSON;PEALL, ROBERT GEORGE;HARCOURT, ROGER WILLIAM