| 摘要 |
<p>PURPOSE: To obtain a semiconductor device which can miniaturize the outer shape of a package and which can be mounted, at high density, onto a printed- circuit board or the like. CONSTITUTION: Electrodes 3 are installed on the side of short sides of a semiconductor element 2. All leads 11 are installed so as to be parallel with long sides over the inside and the outside of a package A and so as to be exposed from the side of the short sides. Bent parts 11e and wide parts 11d are formed at tip parts of inner leads 11a. The electrodes 3 and the leads 11 are connected by wires 5 at the inside of the package A. Pad leads 12 by which a pad 1 on which the semiconductor element 2 is mounted is held on a frame are provided.</p> |
