发明名称 SUBSTRATE TREATMENT DEVICE AND METHOD
摘要 <p>PURPOSE: To provide substrate treatment device and method for preventing a substrate on a retention part from deviating horizontally and positively performing treatment. CONSTITUTION: Both vacuum chucks of a circular-plate-shaped retention part 3 and an annular retention part 4 are activated for a period of time, for example, approximately 0.1-0.5 seconds, when passing a substrate 2 between the circular-plate-shaped retention part 3 and the annular retention part 4.</p>
申请公布号 JPH08241919(A) 申请公布日期 1996.09.17
申请号 JP19960025559 申请日期 1996.02.13
申请人 TOKYO ELECTRON LTD 发明人 HASEBE KEIZO
分类号 H01L21/683;G03F7/30;H01L21/027;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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