| 摘要 |
PURPOSE: To obtain a semiconductor device which enhances a signal transmission rate by a stray capacitance between a semiconductor chip and a lead, which reduces an electric noise and which prevents the short circuit of a bonding wire. CONSTITUTION: In a semiconductor device, shared inner leads 3A2 are bonded, via an insulator, to parts near the central line along the long side of the circuit formation face of a rectangular semiconductor chip, a plurality of inner leads 3A1 for signals are bonded via an insulator, and the inner leads 3A1 , the shared inner leads 3A2 and the semiconductor chip are connected by means of bonding wires so as to be sealed with a resin. The plurality of inner leads 3A1 for signals are arranged on both sides of the shared inner leads 3A2 , outer leads 3B and outer leads 3B which are integrated with the plurality of inner leads 3A1 for signals are derived from side faces of the long side of a sealing resin. |
