CAPACITIVE CIRCUIT DEVICE FOR TRANSMITTING SIGNAL BETWEEN CHIP LAYERS OF VERTICALLY INTEGRATED CIRCUIT,AND ITS CREATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a capacitive signal transmission circuit device to be set in a desired position between chip layers in a vertically integrated circuit, in which a plurality of reliable signal connections (paths) are formed directly from an inside of one chip layer to another adjoining chip layer. SOLUTION: In a capacitive signal transmission circuit device which is placed between chip layers in a vertically integrated circuit, a coupling capacity (Ck) is provided between a circuital part in a chip layer (Ln+1 ) and another circuital part in another chip layer (Ln ).