发明名称 |
Mounting construction and method of a semiconductor device by which deformation of leads is prevented |
摘要 |
There is provided a mounting construction which prevents leads of a semiconductor device from being short circuited when the semiconductor device is mounted on a mounting board so that mountability of the semiconductor device is improved. A plurality of outer leads extend from sides of a package of the semiconductor device. A mounting board has a surface on which a plurality of terminals to be electrically connected to the semiconductor device are provided. A mounting member is mounted on the mounting board separately from the semiconductor device. The semiconductor device is attached to the mounting member. The mounting member has a frame member forming a space in which the semiconductor device is placed. A first connecting lead has a first lead connecting portion and a first external connecting portion to be connected to a one of terminals provided on the mounting board. The first external connecting portion extends along a bottom surface of the frame member. A second connecting lead has a second lead connecting portion and a second external connecting portion to be connected to a one of the terminals provided on the mounting board. The second external connecting portion extends along a bottom surface of the frame member. The first external connecting portion and the second external connecting portion are arranged alternately with a predetermined distance apart from each other in a direction along an extending direction of the frame member. |
申请公布号 |
US5557145(A) |
申请公布日期 |
1996.09.17 |
申请号 |
US19950401441 |
申请日期 |
1995.03.09 |
申请人 |
FUJITSU LIMITED |
发明人 |
KOBAYASHI, HITOSHI;ASANO, YUICHI;KOBAYASHI, KENJI;SASAKI, KENICHI;SAKURAI, YUJI |
分类号 |
H01L23/28;H01L23/32;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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