发明名称 POLISHING METHOD AND POLISHING MACHINE USED THEREFOR
摘要 PURPOSE: To polish with excellent flatness without decelerating a polishing rate by maintaining the surface roughness of a polishing cloth substantially equal to that before the start of polishing, polishing halfway, then gradually reducing the surface roughness and continuing the residual polishing. CONSTITUTION: The grinding abrasive particles of a rotary grinding head 5 are brought into slidable contact with a polishing cloth 1, the surface to be polished of a base 6 held by a base holding pedestal 7 is brought into slidable contact to be simultaneously ground to polish the base 6 under the conditions maintained substantially equal to the surface roughness of the cloth 1 to that before the start of polishing. The surface to be polished of the base 6 is brought into slidable contact with the cloth 1 in the state that the polishing abrasive particles 4 of the head 5 are separated from the cloth 6 to continuously polish the residue of the base 6 under the condition that the surface roughness of the cloth 1 is gradually decreased. Thus, the polishing with excellent flatness can be conducted without decelerating the polishing rate.
申请公布号 JPH08241878(A) 申请公布日期 1996.09.17
申请号 JP19950044065 申请日期 1995.03.03
申请人 SONY CORP 发明人 MUROYAMA MASAKAZU;SASAKI MASAYOSHI
分类号 B24B37/20;B24B37/24;B24B53/00;B24B53/017;H01L21/304 主分类号 B24B37/20
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