| 摘要 |
PURPOSE: To enhance the heat dissipating property of a resin sealed product comprising a heat generating body in the interior by a method wherein beads for heat conduction in which heat conducting bodies are covered with insulating covering bodies are mixed so as to coexist inside a sealing body. CONSTITUTION: Many beads 7 for heat conduction are mixed so as to coexsit inside a sealing body 2 composed of an epoxy resin or the like for a resin sealed semiconductor device 1. The beads 7 for heat conduction are of a structure in which heat conducting bodies 8 are covered with insulating covering bodies 9. The heat conducting bodies 8 are composed of, e.g. metal particles composed of copper or aluminum whose thermal conductivity is high. In addition, the covering bodies 9 are formed of a resin. As the resin which forms the covering bodies 9, a resin whose softening temperature is higher than that of the resin forming the sealing body 2 for the resin sealed semiconductor device 1 is selected and used. In a transfer molding operation in the manufacture of the resin sealed semiconductor device 1, the heat conducting bodies 8 are not exposed when the covering bodies 9 for the beads 7 for heat conduction are melted. |
