| 摘要 |
PURPOSE: To provide a semiconductor package with a simple configuration by preventing a sealing resin from being peeled off or cracked. CONSTITUTION: In a semiconductor package 10, a wiring pattern 2 is formed toward the outside from a part for mounting a chip and a second insulation film 3 is adhered and laminated so that it covers a part other than the edge portion outside the pattern 2. The first and second insulation films 1 and 3 are 100μm or less thick and the & pattern 2 is a plating layer which is 20μm or less thick or a printed layer by a conductive paste and a lamination body where they are laminated is flexible.
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