| 摘要 |
PURPOSE: To provide a semiconductor device with a function of temperature guarantee to the semiconductor chip, in a semiconductor device equipped with a semiconductor chip, where at least one circuit element and at least two electrode terminal are formed, and at least two external lead terminals electrically connected to each of the two electrode terminals. CONSTITUTION: A strip conductor pattern 10 by a low-fusing-point metallic film such as solder or the like is made through an insulating layer in a chip type board 8 or a semiconductor chip 3 contiguous to the semiconductor chip 3, and one end of this strip conductor pattern is electrically connected to one electrode terminal of the semiconductor chip, and the other end of the strip conductor pattern to one external lead terminal. |
