发明名称 CHIP TYPE CURRENT PROTECTING ELEMENT AND MANUFACTURE THEREOF
摘要 PURPOSE: To suppress emitting smoke or firing on fusion, and enhance the forming accuracy of a wiring part by forming a resin layer for covering the surface with the thickness of 40-200μm fluororesin. CONSTITUTION: An insulating substrate having three layer structure is manufactured by sticking a metal foil 100 and a copper foil 3, for example, on each side of a substrate material preferably comprising a fluororesin and a reinforcing material of cloth or paper. A hole 4 for connecting the edge surface is perforated in the insulating substrate, plated, and a corresponding part of an electrode 6 is formed by etching. A second copper layer 103 of the metal foil 100 exposed by etching is formed so that a plurality of current protecting element wiring parts 7 are put on both sides of the electrode 6 in series in one direction to form one arrangement and these arrangements are formed in line in parallel. A 20-400μm thickness fluororesin film 8 in which a hole is perforated in a part corresponding to the electrode is press-bonded on the surface of the substrate, and each protecting element is obtained by cutting the part of the hole 4. Since the film 8 has high flame resistance, firing of the element is prevented even if overcurrent is passed through.
申请公布号 JPH08235999(A) 申请公布日期 1996.09.13
申请号 JP19950312416 申请日期 1995.11.30
申请人 HITACHI CHEM CO LTD 发明人 TSUYAMA KOICHI;NISHIMURA KOJI;IWASAKI YORIO;TANIGUCHI MINORU;TETSUPOUZUKA MITSUO;SHIMIZU WATARU;KOBORI HISACHIKA;TAKADA KOSUKE
分类号 H01H69/02;H01H85/00;H01H85/02;H01H85/045;H01H85/046;H01H85/06;H01H85/143;(IPC1-7):H01H85/00 主分类号 H01H69/02
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