| 摘要 |
<p>PURPOSE: To reduce a stepped section between the top face of an auxiliary top-face electrode film and the top face of a cover coat by forming the auxiliary top-face electrode film to a section on which the cover coat is not superposed in the top faces of both top-face electrode films so that the auxiliary top-face electrode film is fast stuck on the cover coat. CONSTITUTION: In a chip type resistor 10 with a pair of left and right top-face electrode films 12 formed at both left and right end sections in the top face of a chip type insulating substrate 11, a resistance film 13 shaped so that both ends are superposed partially to both top-face electrode films 12, a cover coat 16 formed so as to cover the whole of the resistance film 13, and end-face electrode films 18 formed on both left and right end faces of the insulating substrate 11 so as to make a continuity with the top-face electrode films 12, auxiliary top-face electrode films 17 are shaped to sections on which the cover coat 16 is not stacked in the top faces of both top-face electrode films 12 so that the auxiliary top-face electrode films 17 are fast stuck to the cover coat 16. Accordingly, the generation of an erroneous attraction and falling during lifting can be prevented surely.</p> |
