发明名称 METHOD OF CORRECTING MOUNTING POSITION OF MOUNTING DEVICE
摘要 PURPOSE: To obtain a proper correction position even if a substrate is distorted by operating a correction position of a part mounting place based on relative position relation of the theoretical position of a part mounting position to the theoretical position of each of four or more measurement points and a measured position of the measurement points. CONSTITUTION: A printed board 3 is provided with a fiducial mark 40 at four or more measurement points in advance. The coordinates of a theoretical position of each measurement point provided with the fiducial mark 40 and the coordinates of a theoretical point of a part mounting place are stored in a memory part 34 of a control device 30 in advance. Then, each fiducial mark 40 is imaged one by one by a substrate recognition camera 27 and each position is measured. After the measured position of the measurement points is obtained, a corrected position of a part mounting place is operated based on a coordinate conversion parameter obtained from relative position relation of the theoretical position of a part mounting place to the theoretical position of each measurement point and the measured position of each measurement point.
申请公布号 JPH08236997(A) 申请公布日期 1996.09.13
申请号 JP19950041554 申请日期 1995.03.01
申请人 YAMAHA MOTOR CO LTD 发明人 MORI TAKAO
分类号 H05K13/04 主分类号 H05K13/04
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