METHOD FOR MOUNTING ELECTRONIC PARTS

摘要

PURPOSE: To provide a method for mounting electronic parts by which the problem of insufficiently fixed electronic parts caused by the warps of the parts can be prevented. CONSTITUTION: By finding the correlation between the magnitude of the warp (a) of electronic parts 1 caused by the difference in coefficient of thermal expansion between a substrate 2 and molded body 3 and the correlation between the magnitude of the warp (a) and the percentage of defective junctions between the electrodes 6 of a printed board 5 and bumps 4, the heating temperature of the parts 1 at which defective junctions caused by the warp (a) of the parts 1 do not occur is found from the correlations and the parts 1 are fixed to the electrodes 6 by melting the bumps 4 by heating the parts 1 to a temperature higher than the heating temperature.