| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a conductive structure at a low cost in particular by providing a conductive layer covering the surface of a daughter structure on the plane exceeding the size of a cut section on the lower face of the daughter structure. SOLUTION: A hardenable liquid material or a plastically deformable material is provided on a parent structure 10, and it is continuously hardened in a first process. The hardened material or the plastically deformable material is separated from the parent structure 10, and a daughter structure 20 having at least one excision section 19 is formed on the lower face. A conductive layer 25 covering the surface of the daughter structure 20 at the excision section 19 is provided on the plane exceeding the size of the excision section 19 on the lower face of the daughter structure 20 in a second process. The conductive layer 25 is removed from the surface of the lower face of the daughter structure 20, and a conductive structure 18 is formed in the excision section 19 in a third process. The parent structure 10 is made of a particularly stable material, preferably a material capable of being deposited by plating, e.g. a metal. |
