| 摘要 |
PURPOSE: To enhance adhesion between an insulating board and an adhesive by bonding the insulating board having a conducting means onto a second burying material coated on a first burying material. CONSTITUTION: A burying material 41 containing a defoaming agent and a burying material 42 containing no defoaming agent are disposed between an insulating resin 33 to be provided with a conducting means and an insulating board 36. Since the conducting means is 70μm thick, i.e., two times as thick as normal film or more, irregularities are generated on the surface when the insulating board 36 is pasted normally and it can not be mounted well. Consequently, a dam member 43 thicker than the conducting means is provided and the materials 41, 42, having low viscosity, are buried in the dam region so that the buried materials stay in the dam region to make flat the surface. In general, a defoaming agent is contained in order to defoam when the material is buried and removed. Since excess defoaming agent floats on the surface a second burying material 42, composed of substantially same material as the burying material 41 but mixed with no defoaming agent, is further provided and the insulating board 36 is pasted thereon through an adhesive.
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