| 摘要 |
<p>PURPOSE: To prevent a semiconductor pellet from being damaged due to a failure (wear, deformation, breaking, etc.) of a push-up needle. CONSTITUTION: In a pickup device in which each tip of at least two push-up needles 6 is placed in contact with a bond surface of a semiconductor pellet 10 bonded to an adhesive tape 11, and which is provided with a pellet push-up mechanism 2 pushing the semiconductor pellet 11 upward by each of these two push-up needles, the device comprises a power supply 3 which impresses a voltage between the two push-up needles 6, a voltmeter which reads a voltage impressed between the two push-up needles 6 or a current meter which reads a current running as a result of the impressed voltage.</p> |
