| 摘要 |
PURPOSE: To obtain a copper alloy lead frame for bare bonding suitable for wire bonding employing an aluminum wire. CONSTITUTION: The high strength copper alloy lead frame contains Fe and P and strengthened through deposition of intermetallic compound of Fe2 P. The copper alloy lead frame for bare bonding contains total 0.20wt.% or less of at least one kind of 0.005-0.150wt.% of Zn and 0.005-0.050wt.% of Ni having conductivity of 85% IACS or above and Vickers surface hardness (Hv) lower than 120 with the mirror surface reflectance being set at 30% or above at die bond part and the thickness of oxide film being set thinner than 80Åon the surface of the lead frame. |
