| 摘要 |
PURPOSE: To increase the bond strength between an insulating resin and metallic wiring by roughening the surface of the insulating resin after the resin is cured to a semihardened state before the metallic wiring is formed on the surface of the resin, and then, post-curing the resin to a completely hardened state. CONSTITUTION: In a printed wiring board manufacturing method adopting a building-up technique by which a metallic wiring layer and insulating layer are successively piled up, a process for curing an applied insulating resin layer 13 to a dried state or semihardened state, process for forming a current film 14 on the surface of the resin layer 13, process for forming a metallic wiring layer 14 on the film 14, and process for curing the resin 13 to a completely hardened state are successively performed. Therefore, the bonding strength between the resin 13 and the metal 15 of the wiring 15 can be improved, because a chemical bond can be obtained between the metal 15 and resin 13 during the process of the resin 13 from gelatification to hardening which occurs when the resin 13 is post-cured. |
