| 摘要 |
PURPOSE: To provide the title semiconductor device and manufacturing method thereof in the chip scale package type yet capable of freely setting up the arrangement of outer electrode to be soldered onto the conductor end of packaged circuit substrate without being restricted by the arrangement of semiconductor chip electrode within the range of chip scale. CONSTITUTION: Within the title semiconductor device composed of a semiconductor chip 1 and an auxiliary wiring sheet piece 2 sealed with a resin 3, the sheet piece 2 has insulating layers 24, 25 on both surfaces of a routing conductor 23 while a hole 213 from the conductor 23 facing on the electrode 11 of the chip 1 is made in the layer 24 on the chip 1 side so that an inside electrode 21 may be composed of metallic bumps 211 protruding from this hole 213 formed of a metal 212 filling up this hole 213. Besides, this semiconductor device can be manufactured by TAB method. |
