发明名称 WIRE BONDER
摘要 PURPOSE: To surely set the target ball size of a bonding wire reliably and auto matically in a short time. CONSTITUTION: An applying voltage from a discharge unit 4 is made to vary arbitrarily at two places or thereabout to form balls and the respective initial ball diameters of the balls are measured by a ball recognition measuring part 6 on the basis of the projected images from a camera 5. As those initial ball diameters, which are formed by the arbitrarily applied voltage, have the proportionality between them, the initial ball diameters of target that an operator wants to form are inputted from a setting part 7 after the measurement. Whereupon a control part 8 carry out a control so that an applying voltage corresponding to the formation of the target initial ball diameters is outputted from the unit 4 on the basis of the proportionality between those initial ball diameters and balls of a target size are automatically formed.
申请公布号 JPH08236567(A) 申请公布日期 1996.09.13
申请号 JP19950037995 申请日期 1995.02.27
申请人 HITACHI TOKYO ELECTRON CO LTD 发明人 HIRATA JUNICHI
分类号 G01B11/08;H01L21/60 主分类号 G01B11/08
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