发明名称 METHOD OF MOUNTING CHIP
摘要 PURPOSE: To eliminate lowering of mounting precision caused by change of a relative position of a head and a camera due to thermal expansion of a holder wherein a head and a camera are built integrally which is caused by heat generation of a motor for moving a nozzle up and down. CONSTITUTION: Misalignment of a nozzle 2 due to thermal expansion of a holder 3 caused by heat generation of a motor 5 which drives a head is detected by a camera 19 for chip recognition. The misalignment is found by observing a mark 18 formed in a specified position by a camera 4 for substrate recognition. Thereafter, a chip 10 is transferred and mounted on a substrate 15 while movement stroke of a head is corrected based on the determined misalignment.
申请公布号 JPH08236995(A) 申请公布日期 1996.09.13
申请号 JP19950035192 申请日期 1995.02.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORITA TAKESHI
分类号 B23P21/00;H05K13/04;H05K13/08 主分类号 B23P21/00
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