| 摘要 |
PROBLEM TO BE SOLVED: To obtain passive positioning, by providing a substrate part where an LED device is connected directly and electrically and bonding pads are formed for self-alignment, and providing a substrate part with a mechanical reference for positioning other optical mount components. SOLUTION: Two connection pad positions 601 are formed on a silicon wafer 600. The positions have length and width close to those of bonding pads 120 and 121 of an LED. A lead 602 connects a connection pad position 601 electrically to an optical package circuit. A mechanical positioning reference 610 in the silicon wafer 600 is precisely arranged for the connection bonding pad position 601, and matched with similar references formed in attached optical components such as a lens holder and an optical fiber ferrule. The optical components can be positioned passively during optical package assembly operation. |
