| 摘要 |
PURPOSE: To laminate a large number of semiconductor chips by laminating the wiring pads exposed to the side faces of a semiconductor chip and other exposed wiring pads while connecting through a wiring part formed on each side face of the semiconductor chip through metal deposition. CONSTITUTION: A plurality of semiconductor chips 1, each formed with a semiconductor laminated circuit, are laminated vertically. In other words, the wiring pads 2 exposed to the side face of the semiconductor chips 1 are connected with the wiring pads 2 exposed to the side face of another semiconductor chip 1 laminated thereon through the wiring parts 3 formed on each side face of the semiconductor chips 1 through metal 5 deposition. When the wiring pads 2 provided on the side face of the semiconductor chips 1 are interconnected through the wiring parts 3, the wiring pads 2 can be prevented from being concealed even if another semiconductor chip 1 is laminated on one semiconductor chip 1. With such arrangement, a large number of semiconductor chips 1 can be laminated. |
